Tiny PCB, Inc.

Tiny PCB has been driven by the demanding quality standards of the miniaturization trend in wafer level packaging. Our mission is to provide proprietary high-density interconnect solutions to break the technology barriers for higher signal integrity challenges and to minimize the gap between Wafer/chip technologies and the PCB/substrate infrastructure for an optimized, miniaturized packaging design.

Tiny PCB provides proprietary high (TPHD), ultra (TPUD) and extreme (TPED) density designs for fan-in wafer level packaging (FIWLP), fan-out wafer level packaging (FOWLP) and wafer level chip scale packaging (WLCSP) which is necessary for the future miniaturization of advanced electronic devices.

Tiny PCB pre-designed layouts and proprietary ecosystems enable hardware developers to innovate faster by improving the speed and precision of the way electronics are developed while also reducing the cost and time to market. 32 US and 32 EU granted patents on modular fan-out designs and thousands of pre-designed solutions which includes proprietary wide range of high-density ready to use designs for wafer level packaging.

Innovation is at the heart of Tiny PCB strategy to accelerate advanced packaging in an increasingly electric world. Integrating our novel design partitioning methods, we leverage unique pattern design technologies to address some of the significant barriers to the continued adoption of miniaturization trend and next generation high density packages. We have used a novel approach to develop a very promising interconnect footprint for the future FPGA chips. Our goal was in particular to optimize the highest count of ins and outs in the smallest package.

Tiny PCB has developed an advanced high I/Os packaging count that brings artificial intelligence to the edge in a way that existing designs methods are not capable.

Tiny PCB portfolio of packaging designs covers a wide range of applications: Artificial Intelligence, ML devices, DL systems and edge computing