Categories: DataSemiconductor
More Data Faster. Merging PCB, Substrate, and Semiconductor Packaging into a revolutionary new insulator material for the next generation of Interconnects.
Investors 1
Funding Rounds 1
| Date | Series | Amount | Investors |
| 29.04.2024 | Series A | $23M | - |
Mentions in press and media 5
| Date | Title | Description |
| 15.08.2024 | Thintronics Closes Its Series A Extension | Thintronics, Inc., a Berkeley, CA-based electronic materials startup, raised an undisclosed amount in Series A extension.
The round was led by Maverick Capital and Translink Capital with participation from M Ventures, the CVC arm of Merck K... |
| 01.05.2024 | Thintronics: Revolutionizing Electronic Materials | Thintronics, a California-based electronic materials startup, has closed a $23 million Series A funding round, led by Maverick Capital and Translink Capital. The company is on a mission to disrupt the industry by supplying high-performance ... |
| 29.04.2024 | Thintronics Closes $23M Series A Financing Round | Thintronics, a Berkeley, CA-based electronic materials startup, raised $23M in Series A funding.
The round was led by Maverick Capital and Translink Capital.
The company intends to use the funds to support commercialization of a novel insul... |
| - | Thintronics: Electronic Materials Company Closes $23 Million | Thintronics is a California-based electronic materials startup that supplies high-performance insulators for emerging AI data centers, networking, and RF/millimeter-wave (mmW) applications. It raised a $23 million Series A funding round, le... |
| - | Thintronics | “More Data Faster. Merging PCB, Substrate, and Semiconductor Packaging into a revolutionary new insulator material for the next generation of Interconnects.” |
Reviews 0
