Hero Electronix is the Hero Group’s venture into the technology space with a vision to create leading technology businesses from India. We intend to create scaled businesses by focusing on high growth domains centered around consumer products and enterprise solutions.
Our partnership with Hero Electronix (www.heroelectronix.com) enables us to become a stronger turnkey solution provider by expanding our services portfolio and investing in the development of our technology expertise. We plan for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality.
Tessolve is a leading end-to-end solution provider, from chip design, test engineering, and PCB engineering through embedded systems development. With 1600+ employees worldwide, Tessolve enables customers a faster time-to-market through deep domain expertise in Analog, Digital, Mixed Signal, and RF, broad ATE platform experience and built-in infrastructure including a test floor, characterization, reliability lab and PCB FAB. Tessolve allows customers to leverage high-end engineering in a cost-effective model by being able to scale teams to meet exact customer needs. Tessolve’s solution enables a seamless transition from development to production and beyond.
With 90% Engineers, Tessolve offers a unique engineering model where we bridge the gap between pre and post-silicon development and final system integration. The chip design team focuses on end-to-end solutions for Analog, Digital & Mixed signal IP and full-chip SoC implementation. We offer flexibility to the customer by being able to provide individual services like DFT or turnkey chip implementation from RTL to GDS II sign-off.
Tessolve provides services to an impressive group of global companies such as Qualcomm, Broadcom and NXP, that can attest to the quality of Tessolve’s work. Tessolve has engineering teams in India, Singapore, China, Malaysia and across Europe and North America.
Our partnership with Hero Electronix (www.heroelectronix.com) enables us to become a stronger turnkey solution provider by expanding our services portfolio and investing in the development of our technology expertise. We plan for tomorrow’s customer in 5G, Autonomous driving, Artificial Intelligence, and Virtual Reality.
Tessolve is a leading end-to-end solution provider, from chip design, test engineering, and PCB engineering through embedded systems development. With 1600+ employees worldwide, Tessolve enables customers a faster time-to-market through deep domain expertise in Analog, Digital, Mixed Signal, and RF, broad ATE platform experience and built-in infrastructure including a test floor, characterization, reliability lab and PCB FAB. Tessolve allows customers to leverage high-end engineering in a cost-effective model by being able to scale teams to meet exact customer needs. Tessolve’s solution enables a seamless transition from development to production and beyond.
With 90% Engineers, Tessolve offers a unique engineering model where we bridge the gap between pre and post-silicon development and final system integration. The chip design team focuses on end-to-end solutions for Analog, Digital & Mixed signal IP and full-chip SoC implementation. We offer flexibility to the customer by being able to provide individual services like DFT or turnkey chip implementation from RTL to GDS II sign-off.
Tessolve provides services to an impressive group of global companies such as Qualcomm, Broadcom and NXP, that can attest to the quality of Tessolve’s work. Tessolve has engineering teams in India, Singapore, China, Malaysia and across Europe and North America.
Location: India, Karnataka, Bengaluru
Employees: 1001-5000
Total raised: $40M
Founded date: 2004
Investors 1
Date | Name | Website |
- | Applied Ma... | appliedmat... |
Funding Rounds 1
Date | Series | Amount | Investors |
12.05.2021 | - | $40M | - |
Mentions in press and media 15
Date | Title | Description |
10.09.2024 | Tessolve が TÜV SÜD から ISO 26262 - 自動車機能安全プロセス認証を取得 | 認証は Tessolve にとって重要な業界マイルストーンです 「Tessolve は長年にわたり、自動車および機能安全の分野で大きな進歩を遂げてきました。ISO26262 認証の取得は、画期的な出来事であるだけでなく、当社のチームが一貫して提供している高” — Srini Chinamilli, Co-founder & CEO, TessolveTOKYO, JAPAN, September 9, 2024 /EINPresswire.com/ -- 次世代製品向... |
24.07.2024 | Tessolve Partners with SigmaSense to Develop their Innovative DSP-based Sensing ASIC | Capitalizing on our expertise in pre-silicon design and post-silicon test, we developed the touch sense control solution, facilitating a smooth progression through the entire development process.” — Srini Chinamilli, Co-founder & CEO, T... |
29.05.2024 | TessolveとNXPは、二輪車の大衆市場向けデジタル・コネクテッド・クラスターの製品化を可能にします | 技術提携 二輪車および三輪車市場向けに、すぐに製造できるデジタル・コネクテッド・クラスター(DCC)プラットフォームを提供します。 「高度なパフォーマンスグラフィックスと豊富なワイヤレスおよびオーディオ接続を備えたNXP i.MX RT1170ベースのクラスターは、デジタル運転の経験を提供し、二輪車での移動の未来を形作ります。」” — Kiran Kumar Nagendra氏、Tessolve、AVP-Embedded SystemsTOKYO, TOKYO, JAPAN,... |
02.05.2024 | Tessolve unveils SMARC system on module with Renesas RZ/V2H MPU for Industrial, Robotics & Transportation markets | Technology collaboration delivers ready-to-integrate system on module & computer vision system solutions for OEMs, streamlining product realization cycle. Tessolve’s SMARC SOM, based on Renesas RZ/V2H MPU, aims to deliver an AI-powered ... |
09.04.2024 | Tessolve and NXP enable the Productization of Digital Connected Clusters for mass-market Two-Wheelers | Technology collaboration Delivers a ready-to-manufacture Digital Connected Cluster (DCC) platform for the 2-wheeler and 3-wheeler market. Our NXP i.MX RT1170-based cluster with advanced performance graphics and rich wireless and audio conne... |
28.02.2024 | Tessolve embarks on strategic collaboration with Keysight to accelerate time-to-market for high-speed designs | This collaboration with Keysight aligns perfectly with Tessolve's mission to provide semiconductor and systems companies with end-to-end test, characterization, and validation services.” — Huzefa Cutlerywala, SVP Sales and Marketing, Tessol... |
17.08.2023 | Tessolve Joins Intel Foundry Services Accelerator Design Services Alliance to Supercharge Time to Market for Customers | This collaboration enables us to harness the cutting-edge manufacturing technologies and unparalleled expertise of IFS, propelling us to offer enhanced value to our customers.” — Huzefa Cutlerywala, SVP Sales and Marketing, TessolveSAN JOSE... |
19.05.2021 | MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software | MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software 19-05-2021 NANO SoM & evaluation board powered by MediaTek i500 powers portable, home, and commercial IoT applications – MediaTek, the wor... |
23.04.2021 | Hero Electronix's portfolio company Tessolve raises US $40 million from Singapore-based Novo Tellus | Tessolve, a Hero Electronix venture and a global provider of engineering and R&D services to semiconductor companies, has raised $40 million from Novo Tellus Capital Partners, a leading private equity firm based out of Singapore at a $1... |
23.04.2021 | Tessolve Raises US $40M in Funding | Tessolve, a Bengaluru, India-based global provider of engineering and R&D services to semiconductor companies, raised $40m in funding. Novo Tellus Capital Partners made the investment at a $100m valuation. The company intends to use the... |
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