Nextreme Thermal Solutions (Acquired by Laird PLC)
Nextreme designs and manufactures micro-scale thermal and power management products that overcome thermal and power constraints in electronics for the semiconductor, photonics, consumer, automotive and defense/aerospace industries. Nextreme's thermal copper pillar bump addresses the most challenging thermal and power management constraints in electronics today, and delivers the only fully-scalable technology solution by leveraging the existing, high-volume flip chip manufacturing infrastructure. Acquired by Laird PLC.

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