Mosaic Microsystems' proprietary thin glass thin glass solutions address the demanding next generation microelectronics and photonics packaging needs.
Investors 1
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Mentions in press and media 1
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11.04.2024 | Mosaic Microsystems Announces Strategic Hire: Andrew Garland Joins as Sr. Process Engineer to Drive Next-Gen Glass Interposer Packaging Solutions | ROCHESTER, N.Y., April 11, 2024 /PRNewswire/ -- Mosaic Microsystems, a leader in the field of microelectronic glass packaging solutions using glass substrate, announced today the addition of Andrew Garland to its engineering team as a proce... |