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http://www.kinsus.com.tw/
Kinsus Interconnect Technology Corporation
TrustedLast activity: 30.07.2026
Active
Business:Kinsus Interconnect Technology Corp. engaged in manufacture and distribution of electronic parts. The Company provides plastic ball grid array (BGA) substrates, multi-chip-modules (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates and chip on flex (COF), among others. Its products are applied in manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products, among others.
Overview
Employees
5001-10000
Founded date
2000
Investors 1
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Mentions in press and media 2
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| May 21, 2026 | AMD: $10 Billion Investment To Accelerate AI Infrastructure Through Taiwan Ecosystem Partnerships | AMD announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The company said the investments are designed ... |
Reviews 0
FAQ about Kinsus Interconnect Technology Corporation
When was Kinsus Interconnect Technology Corporation founded?
Kinsus Interconnect Technology Corporation was founded in 2000.
What has the press written about Kinsus Interconnect Technology Corporation?
Parsers VC has collected 2 articles mentioning Kinsus Interconnect Technology Corporation, among them “AMD: $10 Billion Investment To Accelerate AI Infrastructure Through Taiwan Ecosystem Partnerships” (May 21, 2026).
Is Kinsus Interconnect Technology Corporation still active?
Yes, Kinsus Interconnect Technology Corporation is active; its latest activity on Parsers VC dates from Jul 30, 2026.