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| Sep 8, 2026 | Samsung Foundry Pivots Half of 4nm Capacity to HBM4: External Customers Compete With Own Fab | By Katie Osborne
Published: Sep 08 2026, 10:12 AM EDT
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| Sep 7, 2026 | Micron Posted Fastest DRAM Revenue Growth in Q2 2026; SK Hynix’s HBM Lead Was Its Liability | By Oscar Lazenby
Published: Sep 07 2026, 12:50 PM EDT
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| Sep 4, 2026 | Xiaomi 18 Fold Debuts at IFA With XRing O3, First Chip to Clear 5 Million AnTuTu | By Caleb Pittmann
Published: Sep 04 2026, 12:59 PM EDT
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| Aug 31, 2026 | CXMT Ships LPDDR6 First: Xiaomi 18 Fold Arrives With Chinese Memory Inside | By Elijah Armfield
Published: Aug 31 2026, 10:18 AM EDT
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| Aug 26, 2026 | Samsung Moves AI Compute Into DRAM: Drop-In Memory Chip Triples Inference Speed | By Elijah Armfield
Published: Aug 26 2026, 3:14 PM EDT
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| Aug 24, 2026 | Xiaomi Xring O3 Tops 5M AnTuTu With All-Big-Core CPU and First LPDDR6 Mobile Chip | By Elijah Armfield
Published: Aug 24 2026, 10:17 AM EDT
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| Aug 15, 2026 | South Korea Chip Data: Memory Up 277%, Logic Down; AI Buys Bandwidth, Not Compute | By Scott McCain
Published: Aug 15 2026, 8:50 AM EDT
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| Aug 12, 2026 | AMD Radeon RX 9070 XT Hits $1,038 in Official China Guidance, Closing Gap With Nvidia | By Jeremy Fielding
Published: Aug 12 2026, 11:32 AM EDT
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| Aug 10, 2026 | Camtek Piles Up $600M in Orders While AI CapEx Forecasters Debate Slowdown | By Collin Mercer
Published: Aug 10 2026, 7:25 PM EDT
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| Aug 4, 2026 | CXMT to join front-runners with new chip | Visitors gather at CXMT's booth during a high-tech expo in Hefei, Anhui province, on April 26. CHINA DAILY
China is moving nearer to closing a key gap in high-end mobile memory, as the latest progress of ChangXin Memory Technologies, or CXM... |
| Aug 3, 2026 | Framework Laptop 13 Pro Review: Best Modular Laptop Hits 15-Hour Battery at RAM-Crisis Price | By Caleb Pittmann
Published: Aug 03 2026, 3:25 PM EDT
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| Aug 3, 2026 | CXMT closes in on LPDDR6 mass production | Chinese memory chipmaker ChangXin Memory Technologies, or CXMT, is reportedly nearing the end of research and development validation for its first LPDDR6 chip, moving it closer to mass production in the race for next-generation mobile memor... |
| Aug 2, 2026 | CXMT Nears LPDDR6 Production: DUV Ceiling Shows Up in 12.8 Gbps vs. 14.4 Gbps Gap | By Roger Satterfield
Published: Aug 02 2026, 3:13 PM EDT
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| Aug 1, 2026 | South Korea Chip Exports Top $40B for Second Straight Month as KOSPI Stages Record Recovery | By William Chan
Published: Aug 01 2026, 1:17 PM EDT
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| Jul 12, 2026 | SK Hynix Soars 13% on Nasdaq Debut: HBM Architecture Makes It Irreplaceable in AI Chips | By Eloise Jones
Published: Jul 12 2026, 10:25 AM EDT
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| Jul 7, 2026 | Samsung Smashes Tech Profit Record: 19-Fold Surge Fails to Halt 7% Stock Drop | By Joshua Mitchell
Published: Jul 07 2026, 9:36 AM EDT
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| Jun 28, 2026 | South Korea Unveils $649B Samsung-Led AI Push Into Chips, Data Centers, Robots | By Jerry Owens
Published: Jun 28 2026, 11:59 PM EDT
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| Jun 5, 2026 | Nvidia Vera Rubin HBM4: Jensen Huang Confirms All Three Suppliers in Production for Q3 Ship | By Allen Lee
Published: Jun 05 2026, 16:48 PM EDT
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| May 28, 2026 | Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution | Arasan Chip Systems Announces Industry's First Sureboot™ Total 16-bit xSPI + PSRAM IP Solution including support for AP Memory's Xccela™ PSRAM and the latest LVpSRAM™
SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- Arasan Chip Systems, a lea... |
| Mar 13, 2026 | MetaOptics Ships Automatic Metalens Tester to Taiwanese Partner Pin-Jye Nano Technologies | Strengthening Regional Testing Capabilities and Supporting Mass Production of Metalens
SINGAPORE, March 13, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsid... |
| Feb 23, 2026 | M31 Validates MIPI M-PHY v5.0 IP on 4nm, Advances 3nm Development to Enable UFS 4.1 Applications | HSINCHU, Feb. 23, 2026 /PRNewswire/ -- M31 Technology (M31), a global leader in silicon intellectual property (IP), today announced that the silicon-proven MIPI M-PHY v5.0 IP has been validated on an advanced 4nm process node and is activel... |
| Dec 30, 2025 | FPT Exports Its First Commercial Chip Shipment to the Japanese Market | HANOI, Vietnam, Dec. 30, 2025 /PRNewswire/ -- FPT Corporation (hereafter "FPT") officially delivered its first commercial shipment of power chips (Power ICs) to a leading Japanese electronics corporation, through the distribution ... |
| Oct 7, 2025 | Next-gen storage for phones is nearly as fast as PCs, but you can’t use it today | What’s happened? JEDEC, the organization that develops the UFS standard, has revealed details about the UFS 5.0 storage standard that will soon power smartphones. This time around, the focus is also on how storage modules can meet the growi... |
| Sep 12, 2025 | SK hynix Completes World's First HBM4 Development and Readies Mass Production | - The company is ready to supply the best-in-class HBM4 to customers according to their plans and to maintain competitive position
- The product's bandwidth has doubled and power efficiency has improved 40% compared to the previous generati... |
| Sep 11, 2025 | SK hynix Begins Supplying Mobile NAND Solution ZUFS 4.1 | Company achieves world-first mass production of high-performance NAND solution products and starts supplying them to the mobile market
The solution significantly improves sustained performance compared to conventional UFS, reducing app laun... |
| Aug 7, 2025 | Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory | ArmorBoot MX76 Features Ultra-Fast Boot Times, High Performance, Integrated Authentication Protection, Data Integrity Verification, Secure Update, SPI Interface, Low-Power Options
HSINCHU, Aug. 7, 2025 /PRNewswire/ -- Macronix International... |
| Feb 27, 2025 | Open Compute Project Foundation and JEDEC Drive Open Silicon Innovation | New Chiplet Design Kits Enable New Silicon Supply Chains
AUSTIN, Texas, Feb. 27, 2025 /PRNewswire/ -- Today, the Open Compute Project Foundation (OCP), the nonprofit organization bringing hyperscale innovations to all, and JEDEC Solid State... |
| Oct 24, 2024 | Kingston Fury Renegade DDR5 CUDIMMs to launch with Intel 800 series chipset compatibility | Kingston Technology has just announced the Kingston FURY Renegade DDR5 CUDIMMs, designed to take advantage of Intel’s upcoming 800-series chipset. This chipset, formerly known as Arrow Lake, is the first to use Clock Drivers on CUDIMMs. At ... |
| Sep 10, 2024 | Protocol Insight® announces the availability of the Marlin A200 A-PHY protocol analyzer and exerciser | Marlin A-200 Analyzer / Exerciser COLORADO SPRINGS, CO, UNITED STATES, September 10, 2024 /EINPresswire.com/ -- Protocol Insight®, the test and measurement market leader in UFS and MIPI UniPro® protocol analysis and traffic generation, toda... |
| Aug 13, 2024 | Introspect Technology: Pioneering the Future of Memory Testing | In the fast-paced world of technology, memory testing is the unsung hero. It ensures that our devices run smoothly, from smartphones to supercomputers. Recently, Introspect Technology has emerged as a beacon in this field, winning accolades... |
| Aug 8, 2024 | Introspect Technology Introduces New Parallel BERT Capable of PAM3 Signaling | SV7C-PAM3
The all-new SV7C-PAM3 is a 12-Channel, highly integrated Bit Error Rate Tester for GDDR7, USB 4, and other interfaces
SANTA CLARA, Calif., Aug. 8, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, leading manufacturer of electroni... |
| Jul 22, 2024 | Разработка сложных процессорных систем на примере модуля SMARC | Приветствую, Хабр! Долго не мог решиться, стоит ли писать статью по разработке устройств на процессорах. Материала и опыта по этой теме очень много, а если описывать все этапы проектирования, то нужно делать целый цикл статей. Но по факту э... |
| Jul 11, 2024 | Optimism abounds as semiconductor industry takes aim at AI-fueled trillion-dollar market
New government funding boosts packaging
AI drives renewed interest
Opportunity at the edge
Your vote of support is important to us and it helps us keep the content FREE.
One click below supports our mission ... | The wave of adoption for artificial intelligence that is sweeping through the business world has lifted the fortunes of several technology industries, most notably the semiconductor sector.
The processor industry experienced rapid growth in... |
| Jul 9, 2024 | GDDR7: The Future of Video Memory | GDDR7, the next generation of video memory, is set to revolutionize the graphics card industry. With faster speeds and increased efficiency, this new technology promises to take gaming and AI to new heights. Let's dive into the details of t... |
| Jul 7, 2024 | GDDR7 — следующее поколение видеопамяти. Перспективы и особенности технологии | GDDR7 — новое поколение видеопамяти для графических адаптеров, например, для Nvidia Blackwell RTX 50. В ближайшие несколько лет именно эта технология будет применяться в современных продуктах разных производителей, постепенно заменяя собой ... |
| Jun 12, 2024 | SK Hynix confirma produção em massa de memórias GDDR7 para 2025 | Fabricante de memórias SK Hynix revelou quando iniciará fabricação de memórias gráficas DDR7 (Imagem: Divulgação/SK Hynix)
Saiba mais sobre GDDR7 no nosso canal no WhatsApp
Entre Agora
A SK Hynix, empresa sul-coreana que é uma das maiores f... |
| Apr 10, 2024 | Montage Technology Pioneers the Trial Production of DDR5 CKDs | SHANGHAI, April 10, 2024 /PRNewswire/ -- Montage Technology, a leading data processing and interconnect IC company, today announced that it has taken the lead in the trial production of 1st-generation DDR5 Clock Driver (CKD) chips for next-... |
| Mar 27, 2024 | Introspect Technology Ships World's First GDDR7 Memory Test System | M5512 GDDR7 Memory Test System
Massively parallel, 72-channel, 40 Gbps PAM3 ATE-on-Bench test system enables the fastest time to market for memory and GPU makers alike.
MONTREAL, March 27, 2024 /PRNewswire-PRWeb/ -- Introspect Technology, a... |
| Mar 20, 2024 | Samsung представила свои первые модули памяти GDDR7 для видеокарт | Компания Samsung продемонстрировала публике первые модули памяти GDDR7 для видеокарт в рамках выставки GTC 2024. Ранее мы писали о том, что JEDEC приняла новый стандарт, а значит производители готовы к промышленному производству памяти ново... |
| Mar 6, 2024 | Принят новый стандарт памяти для видеокарт GDDR7 | Комитет по стандартизации полупроводниковой продукции JEDEC принял новый стандарт памяти GDDR7, который будет использоваться в видеокартах следующих поколений.
Стандарт получил полное наименование ESD239 Graphics Double Data Rate (GDDR7) SG... |
| Dec 17, 2023 | Утверждён стандарт памяти для ноутбуков CAMM2. У SO-DIMM появился конкурент | Несколько дней назад стало известно об утверждении и публикации нового стандарта оперативной памяти CAMM2 сообществом JEDEC. Достоинство новых модулей заключается в их компактности и скорости работы, в ближайшем будущем, вероятно, CAMM2 поя... |
| Dec 11, 2023 | JEDEC officially recognizes CAMM2 standard -- smaller RAM modules to cram more into less space | Laptops are soon going to benefit from a major memory boost thanks to the recognition of a new standard. CAMM2 is the successor to the familiar SO-DIMM form factor, and its significantly smaller size opens up potential for more memory to be... |
| Dec 11, 2023 | A revolution in laptop RAM is upon us | Dell
It’s time to bid a slow farewell to the SO-DIMM memory standard we’ve grown used to seeing in some of the best laptops. A new standard just got approved by JEDEC, the organization that defines specifications for various types of memory... |
| Dec 11, 2023 | CAMM standard published, opening door for thin, speedy RAM to overtake SO-DIMM | Enlarge / The front of a 128GB Dell CAMM.
Dell reader comments 71
Move over, SO-DIMM. A new type of memory module has been made official, and backers like Dell are hoping that it eventually replaces SO-DIMM (small outline dual in-line memor... |
| Jun 22, 2023 | Protocol Insight® Announces the Marlin A200 A-PHY Protocol Analyzer and Exerciser | COLORADO SPRINGS, COLORADO, UNITED STATES, June 22, 2023/EINPresswire.com/ -- Protocol Insight®, the test and measurement market leader in UFS and MIPI UniPro® protocol analysis and traffic generation, today announced the Marlin A200 protoc... |
| Jan 25, 2023 | Организация OCP и ассоциация JEDEC заявили о новом сотрудничестве | Некоммерческая организация Open Compute Project Foundation (OCP) и ассоциация JEDEC Solid State Technology Association объявили о новом сотрудничестве с целью включения технологий, разработанных с использованием одобренных OCP спецификаций ... |
| Jan 16, 2023 | UFS 4.0 to Replace UFS 3.1 Tech: Anticipated Storage Tech for the Samsung Galaxy S23 | Urian B., Tech Times 16 January 2023, 03:01 am
UFS 4.0 stands for Universal Flash Storage 4.0. It is a storage medium used to store data on digital devices, most commonly on mobile devices. It is similar to Solid State Drives or SSDs. UFS 4... |
| Feb 1, 2022 | What to Expect in 2022 and Beyond: AI, Industry 4.0 and Sustainable Tech Will Demand New Computing Paradigms | By Dave Moore, chief strategy officer and senior vice president at Micron
At the start of a new year, it's customary for Micron to take stock of what the next year (and the years after) will hold. While no one truly has a crystal ball into ... |
| Dec 15, 2021 | Protocol Insight® announces UFS Protocol Analyzer and Exerciser for UFS 4.0 and MIPI M-PHY® Gear 5 now shipping | COLORADO SPRINGS, Colo. (PRWEB) December 15, 2021
Protocol Insight is now shipping the new Falcon C Series of UFS protocol analyzers and exercisers. The Falcon G500C and G550C support protocol analysis and generation of M-PHY 5.0 at speeds ... |
| Jul 7, 2021 | SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense | “Standardization for microelectronics is critical in enabling adoption and supporting robust, secure supply chains. The partnership between SAE and JEDEC brings significant value to our industry and government stakeholders through the advan... |
| Jun 2, 2021 | MICRON TECHNOLOGY, INC.
Micron Technology : Automotive-Grade UFS 3.1 Brings the Latest Smartphone Performance to Your Car | We all know the drill.
Only last year we bought the latest, greatest smartphone, but today the next-generation phone was released. It has a bigger, brighter screen using the latest organic LED (OLED) technology, more memory for all those ap... |
| Jun 1, 2021 | Micron launches 176-layer NAND flash and 1-alpha DRAM chips for the data economy | Did you miss a session from GamesBeat Summit 2022? All sessions are available to stream now. Learn more.
Micron Technology unveiled new memory and storage products that it said could better serve data-driven businesses as the data economy c... |
| Jun 1, 2021 | Micron launches 176-layer NAND flash and 1-alpha DRAM chips for the data economy | Elevate your enterprise data technology and strategy at Transform 2021.
Micron Technology unveiled new memory and storage products that it said could better serve data-driven businesses as the data economy continues to develop.
The new flas... |
| Apr 30, 2021 | JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Bias Temperature Instability of Silicon Carbide (SiC) MOS Devices | JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announces the publication of JEP184: Guideline for Evaluating Bias Temperature Instability of Silicon Carbide Metal-Oxid... |
| Feb 16, 2021 | Protocol Insight® announces MIPI M-PHY® Gear 5 UFS 4.0 Ready UFS Protocol Analyzer and Exerciser | COLORADO SPRINGS, Colo. (PRWEB) February 16, 2021
Protocol Insight is announcing availability of the new Falcon C Series of UFS protocol analyzers and exercisers.
The Falcon series offer unique capabilities such as Smart Tune™ equalization ... |
| Jul 15, 2020 | DDR5 Memory Specification Finalized: Up to 6400GT/s, 2TB LRDIMMs | JEDEC, the consortium in charge of DDR technology development and standardization, has announced that it has completed the last revision to the DDR5 standard. While time-to-market varies, historically it takes 12-18 months from specificatio... |
| Feb 3, 2020 | UFS 3.1 é um padrão de armazenamento mais rápido para celulares | Dois anos depois da apresentação do UFS 3.0, a JEDEC anunciou as especificações finais da memória Flash UFS 3.1. A nova versão herda as larguras de banda do padrão anterior, mas traz recursos que melhoram o desempenho e otimizam o consumo d... |
| Nov 26, 2019 | 3 more emerging memory technologies tackling big-data bottlenecks | This article is part of the Technology Insight series, made possible with funding from Intel.
Ubiquitous connectivity gives the Internet of Things (IoT) and cloud carte blanche to generate data at truly Tribble-like rates. The volume of dat... |
| Nov 26, 2019 | 3 more emerging memory technologies tackling big-data bottlenecks | We are excited to bring Transform 2022 back in-person July 19 and virtually July 20 - 28. Join AI and data leaders for insightful talks and exciting networking opportunities. Register today!
This article is part of the Technology Insight se... |
| May 31, 2019 | Huawei volta ao Android Q Beta e às entidades de Wi-Fi, RAM e microSD | A Huawei voltou a participar das organizações que cuidam de padrões essenciais para celulares e notebooks, incluindo Wi-Fi, Bluetooth, microSD e RAM. Ela retornou à lista de membros da SD Association, Wi-Fi Alliance, Bluetooth SIG e JEDEC a... |
| May 6, 2017 | Some Samsung Galaxy S8 Units Have UFS 2.0, While Others Have UFS 2.1: Does It Matter? | Carl Velasco, Tech Times 06 May 2017, 08:05 am
In hardware manufacturing, particularly with consumer electronics, there's a phenomenon called hardware lottery. If you understand what Forrest Gump's iconic mantra "you never know what yo... |
| Apr 3, 2017 | Memórias DDR5 chegam em 2018 e terão o dobro de velocidade do DDR4 | Você já fez upgrade da RAM do seu computador para DDR4? Pois saiba que as especificações da próxima geração de memórias, chamada de DDR5, estão em desenvolvimento acelerado — e os primeiros módulos, que chegam em 2018, serão capazes de atin... |
| Apr 3, 2017 | Next-generation DDR5 memory will double bandwidth compared with DDR4 | Last week, JEDEC announced that the upcoming DDR5 memory standard will offer double the bandwidth and density of DDR4, improve channel efficiency, and offer better power efficiency as well. The new standard isn’t expected to be in-market un... |
| Apr 1, 2017 | Next Generation DDR5 RAM Will Offer Twice The Bandwidth Of DDR4, But When Will It Arrive? | Carl Velasco, Tech Times 01 April 2017, 02:04 am
DDR5, the next generation of RAM, will offer twice the speeds of current-gen DDR4 RAM come time it's released, according to JEDEC, an organization setting the terms of computer memory standar... |
| Mar 31, 2017 | Next-generation DDR5 RAM will double the speed of DDR4 in 2018 | Enlarge
materod on flickr reader comments 117 with 73 posters participating
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You may have just upgraded your computer to use DDR4 recently or you may still be using DDR3, bu... |
| Feb 10, 2016 | Micron Details New GDDR5X Graphics Memory, With Volume Production Set For This Summer | Horia Ungureanu, Tech Times 10 February 2016, 08:02 am
Micron unveiled new information about its GDDR5X graphics memory, and it looks like the next-gen chip will reach its customers later this year.
The team behind the GDDR5X aimed to desig... |
| Jan 20, 2016 | Graphics cards with 1024GB/s bandwidth? Samsung begins HBM2 production | reader comments 99 with 68 posters participating
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Samsung has begun mass production of 20nm second-generation High Bandwidth Memory (HBM2), which features up to 256 gigabyte... |
| Nov 12, 2014 | Apple Likely to Adopt Next-Gen Flash Memory for 2015 iDevices
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Search | A new Asian report published today reveals that next generation NAND flash will be entering the market in 2015 with Samsung, Toshiba and SK Hynix being the key players now preparing for production. As usual, Samsung is trying to get their m... |
| Feb 24, 2014 | Meet Qualcomm’s Snapdragon 801, a slightly faster Snapdragon 800 | reader comments 7 with 6 posters participating
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MWC Gallery: The novelties and crazy gear edition
Gallery: The weirder side of Mobile World Congress
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| May 9, 2012 | DDR4 memory is coming soon—maybe too soon | Micron's 30-nanometer fabrication process for DDR4 at work.
Photograph by Micron reader comments 99 with 58 posters participating, including story author
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| May 21, 2007 | DRAM Buyer’s Guide | Memory is changing again.
This week, Intel announced its latest core logic, dubbed P35. The new P35 memory controller supports both DDR2 and the new DDR3 memory modules. (See our companion article on the Intel P35 announcement.)
As PC manuf... |