一家集成电路领域产品和服务提供商，核心事业涵盖芯片与方案、硅材料、先进封测三大领域。芯片与方案事业围绕移动终端、智慧家居、智慧交通、工业物联网等应用场景，为客户提供多媒体系统、智能计算、智慧连接、显示交互、车载系统、电源管理等芯片及解决方案。硅材料事业主要包括12英寸全球先进制程硅单晶抛光片和外延片。先进封测事业主要包括专业IC封测、COF卷带、板级系统封测三类业务。
Location: China, Beijing
Member count: 201-500
Founded date: 2016
Investors 1
| Date | Name | Website |
| - | Cii Fund | ciifund.cn |
Mentions in press and media 3
| Date | Title | Description | Category | Author | Source |
| 09.06.2020 | Chinese Io... | Beijing-based chip developer E... | News | Song Jingl... | kr-asia.co... |
| 09.06.2020 | Eswin rais... | Beijing Eswin Computing Techno... | China, Esw... | Manish Sin... | techcrunch... |
| - | Eswin | “Beijing Yi Siwei Technology G... | - | - | fastfounde... |