ERS electronic GmbH, based in Germering close to Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing. ERS also supplies the Advanced Packaging market with its fully automatic and manual debonding and warpage adjust tools used for Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies up to 650 x 650 mm format. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide. Imprint: https://www.ers-gmbh.com/legal Privacy policy: https://www.ers-gmbh.com/privacy-policy
Location: Germany, Bavaria, Germering
Employees: 51-200
Founded date: 1970
Investors 2
Mentions in press and media 12
| Date | Title | Description |
| 29.05.2024 | ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability | MUNICH, May 29, 2024 /PRNewswire/ -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from its Luminex product line. The machines, LUM300A1 a... |
| 09.04.2024 | ERS electronic Announces Agreement with Geringer Halbleitertechnik GmbH & Co. KG to Strengthen R&D and Production Capabilities | MUNICH, April 9, 2024 /PRNewswire/ -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing has finalized an agreement with Geringer Halbleitertechnik GmbH & Co. KG, a move poised to bolster... |
| 13.03.2024 | ERS electronic introduces the first semi-automatic machine of its Luminex product line featuring groundbreaking PhotoThermal debonding technology | MUNICH, March 13, 2024 /PRNewswire/ -- ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing is presenting the first machine from its innovative Luminex product line featuring the cutting-edge &... |
| 06.02.2024 | ERS electronic announces appointment of Debbie-Claire Sanchez as Vice President | Debbie-Claire Sanchez has been appointed Vice President of ERS electronic ERS electronic is pleased to announce that Debbie-Claire Sanchez has been appointed Vice President with immediate effect. Over the past 5 years, we have laid a strong... |
| 14.11.2023 | ERS electronic introduces "High Power Dissipation" Thermal Chuck System, which can dissipate up to 2.5kW at -40°C for Embedded Processors, DRAM and NAND wafer test | MUNICH, Nov. 14, 2023 /PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing its latest "High Power Dissipation" Thermal Chuck System. The ... |
| 01.06.2023 | ERS electronic Welcomes New Investor, European private equity firm Gimv, on Board to Accelerate Scaling Efforts | MUNICH, June 1, 2023 /PRNewswire/ -- ERS electronic GmbH, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce the addition of a new investor, Gimv, a Belgian private equi... |
| 30.05.2023 | ERS introduces Wave3000, a State-of-the-Art Warpage Metrology Tool for Advanced Packaging Wafers | MUNICH, May 30, 2023 /PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a first-of-its-kind equipment for the metrology and analysis of warped waf... |
| 23.05.2023 | PulseForge and ERS electronic Collaborate to Bring Fully-Automated Photonic Debonding Tool to the Semiconductor Industry | A fully-automated photonic debonding solution ideal for fan-out wafer-level packaging, combining photonic debonding with ERS’s automation abilities We are thrilled to partner with the PulseForge team and combine our respective strengths to ... |
| 16.11.2022 | ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330 | MUNICH, Nov. 16, 2022 /PRNewswire/ -- ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measureme... |
| 24.05.2022 | ERS electronic introduces ProbeSense™, a state-of-the-art measurement device for automated temperature calibration in wafer test | MUNICH, May 24, 2022 /PRNewswire/ -- ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a temperature calibration device that allows automatic and highly accurate... |
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