Capcon,华封科技拥有先进封装设备领域全球技术领先的创始团队和产品技术。服务的客户有台积电、日月光、矽品、⻓电科技、通富微电、DeeTee等.公司产品对先进封装贴片工艺实现了全面覆盖，包括FOWLP(Face Up/Down)、POP、MCM、EMCP、Stack Die、SIP、2.5D/3D、FCCSP、FCBGA等
Location: United States, California, Anaheim
Member count: 11-50
Total raised: $50M
Funding Rounds 1
| Date | Series | Amount | Investors | Deal News |
| 06.02.2023 | - | $50M | - | finsmes.co... |
Mentions in press and media 2
| Date | Title | Description | Category | Author | Source |
| 06.02.2023 | Capcon Rai... | Capcon Singapore Pte. Ltd., a ... | Singapore | - | finsmes.co... |
| - | Capcon | “Capcon, Huafeng Technology ha... | - | - | fastfounde... |