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Axus Technology delivers advanced process development expertise, equipment, and service support for: -- CMP & Polishing -- Wafer Thinning and Grinding -- Edge Grinding and Profline -- Substrate Cleaning Applications -- Wafer Bonding Applications. Axus' customers range from leading-edge production semiconductor manufacturers through small development facilities. We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner. Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment. The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.
Total raised: $12.5M
Funding Rounds 1
Date | Series | Amount | Investors |
30.05.2024 | - | $12.5M | - |
Mentions in press and media 3
Date | Title | Description |
30.05.2024 | Axus Technology Raises $12.5M in Funding | Axus Technology, a Chandler, AZ-based global provider of chemical mechanical planarization (CMP) equipment, critical for manufacturing semiconductors and compound semiconductors, raised $12.5M in funding. Backers included IntrinSiC Investme... |
29.05.2024 | Axus Technology Secures $12.5 Million in Capital Funding | Company to Leverage Funds for Expansion of its CMP Products for Silicon Carbide Device Manufacturing CHANDLER, Ariz., May 29, 2024 (GLOBE NEWSWIRE) -- Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equ... |
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