Arieca Inc.
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Arieca Inc.

http://www.arieca.com/
Last activity: 17.05.2022
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Categories: AerospaceAutomationElectronicsHardwareHealthTechManagementMaterialsSemiconductorSocietySoftware
Arieca manufactures and distributes a thermally conductive rubber (Thubber) composite that has a novel combination of properties:

• Ultrasoft: elasticity of soft silicone (100 kPa modulus; 600% strain limit)

• Thermally conductive: thermal conductivity (~5-10 W/m.K) which approaches that of steel
• Tear resistant: metal-like fracture toughness (10-30 kJ/m2) that is 25-50x greater than conventional silicone rubber.

The thermally conductive rubber (while being electrically insulating), which we call “Thubber”, has the potential to revolutionize how heat is managed in automotive, aerospace, personal computing, wearable devices, and other compact electronic technologies (possibly batteries). Compared to existing thermal greases and pads, Thubber has a superior combination of high thermal conductivity, mechanical compliance, and resistance to fracture, tearing, or flaking. As a thermal interface material (TIM), it can rapidly transfer heat away from heat generating electronics (e.g. microprocessors, batteries, radio transceivers, etc.) and allow them to function over long durations without overheating or requiring reductions in speed or power consumption (i.e. throttling). Additionally Thubber can isolate sensitive electronics and avionic systems from mechanical vibration and shock with the ability to draw the heat away from heat generating parts at the same time.
Followers
195
Mentions
3
Employees: 1-10
Total raised: $6.5M
Founded date: 2018

Investors 5

Funding Rounds 1

DateSeriesAmountInvestors
17.05.2022Series A$6.5M-

Mentions in press and media 3

DateTitleDescription
17.05.2022Advanced materials tech startup Arieca raises $6.5M Series A to scale-up manufacturing of its Liquid Metal-based thermal interface materialThe semiconductor industry is currently facing acute heat and power issues. Miniaturization has led to increasing in the number of transistors on a single chip. However, as transistors become smaller, problems with heat dissipation and powe...
17.05.2022Thermal materials startup Arieca closes its $6.5 million Series A with a local lead investorPittsburgh has gained national attention as an economy that could benefit from American manufacturing of semiconductors, and this local startup wants to make ensure the materials industry can keep up with those advancements. Heat dissipatio...
17.05.2022Arieca Raises $6.5M in Series A FundingArieca’s Team in Pittsburgh’s Headquarters. From left to right: Navid Kazem, Vivek Singh, Dylan Shah, Jeffrey Gelorme, Nolan Steeley, and Allyssa Kerr (Photo: Business Wire) Arieca Inc., a Pittsburgh, PA-based materials startup, raised $6.5...

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