| Date | Title | Description |
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| Feb 6, 2025 | congatec launches aReady.IOT | congatec launches aReady.IOT
With aReady.IOT, we are driving the next level of value for our aReady.COM customers. The advanced application integration we enable with aReady.IOT is unmatched.”
— Andreas Bergbauer, Manager Solution Managemen... |
| Jan 9, 2025 | More AI and graphics performance for low-power SMARC modules | New Intel Core 3 processors for improved performance
Update for congatec SMARC modules: new Intel Core 3 processors for improved performance
With up to 8 cores, a low power SMARC module can host a variety of different applications that prev... |
| Jan 9, 2025 | New performance boost for COMs with Intel Core S technology | New high-performance COM-HPC module for demanding real-time applications
congatec launches new high-performance COM-HPC module for demanding real-time applications
The heterogeneous computing architecture, featuring Intel® Graphics and Deep... |
| Sep 26, 2024 | congatec spotlights aReady.COM Computer-on-Modules at embedded world North America | New aReady.COM solution platforms live at embedded world NA. With aReady.COM
A new level of application readiness - for increased efficiency and reliability
The benefit of aReady.COM Computer-on-Modules is that application engineers don't n... |
| Sep 23, 2024 | congatec spotlights aReady.COM Computer-on-Modules at embedded world North America | New aReady.COM solution platforms live at embedded world NA. With aReady.COM
A new level of application readiness - for increased efficiency and reliability
The benefit of aReady.COM Computer-on-Modules is that application engineers don't n... |
| Apr 15, 2024 | congatec introduces 3.5-inch application carrier board for COM-HPC Mini modules | aReady-COM-HPC-Mini-Carrier-3-5-Inch-formfactor
The faster, more sustainable route to dedicated high-end 3.5-inch systems
Customer-specific designs tailored through our design-in services are then the next step to further minimize OEMs’ wor... |
