AI's Heat Crisis: Corintis Secures $24M to Power Next-Gen Chips
September 26, 2025, 10:03 pm
Location: United States, Washington, Redmond
Employees: 1-10
Founded date: 1975
Corintis just secured $24 million in Series A funding, raising its total to $33.4 million. This investment targets AI's major bottleneck: intense chip heat. Powerful processors, vital for generative AI, generate unprecedented thermal loads. Corintis pioneers microfluidic cooling. This optimized, micro-scale liquid system is uniquely co-designed with semiconductors. It aims for ten times better heat dissipation. A partnership with Microsoft achieved a breakthrough. In-chip microfluidic cooling proved three times more effective than current top technologies. Corintis expands globally. New US offices and a Munich engineering hub are planned. Manufacturing capacity will surge. The goal: over one million microfluidic cold plates annually by 2026. This move unlocks next-gen AI and high-performance computing. Corintis confronts the thermal bottleneck directly.
The age of artificial intelligence demands vast computational power. AI models grow larger, more complex. This trend requires increasingly potent computer chips. Yet, these powerful processors create an immense problem: heat. Excessive heat throttles performance. It risks chip failure. Cooling has emerged as a critical bottleneck for AI's future.
Early AI training utilized NVIDIA chips consuming 400 watts. Today, new GPUs and AI accelerators demand ten times that power. Liquid cooling becomes essential. NVIDIA's own shift to liquid cooling for data center GPUs underscores this urgency. Traditional cooling methods fall short. They rely on simplistic designs. These methods cannot cope with modern chip densities.
Corintis steps in with a radical solution. The company focuses on microfluidic cooling. This technology optimizes liquid cooling at a micro-scale. It targets computer chips within data centers. These centers power generative AI and advanced computation. Corintis's approach is unique. It co-designs cooling systems with the chip itself.
Each chip presents a distinct thermal landscape. Billions of transistors connect with countless wires. Corintis creates complex networks of precisely shaped micro-channels. These channels guide coolant to critical hot spots. This customized design overcomes generic cooling limitations. It promises a significant leap in thermal management.
Corintis’s recent $24 million Series A round highlights investor confidence. Total funding now stands at $33.4 million. BlueYard Capital led the round. Founderful, Acequia Capital, Celsius Industries, and XTX Ventures also participated. This capital infusion will fuel expansion. It will accelerate manufacturing capabilities.
The company has strengthened its leadership. Lip-Bu Tan joined the board. He chairs Walden International and serves as Intel CEO. Geoff Lyon also joined. Lyon founded and led CoolIT. These strategic additions bridge the semiconductor industry. They connect design, manufacturing, and advanced chip cooling expertise. This solidifies Corintis's industry position.
A significant breakthrough came from a Microsoft partnership. Corintis collaborated to develop an in-chip microfluidic cooling system. This system was tested successfully. It cooled a server running core services. Tests showed remarkable efficiency. Heat removal was three times better than leading conventional technologies. This achievement pushes boundaries.
This enhanced thermal margin has direct benefits. It translates to more software performance. It allows for greater overclocking potential. Crucially, it enables new 3D chip architectures. Stacking high-power system-on-chips (SoCs) was previously impossible. Thermal limitations prevented inner layer cooling. Corintis technology removes that barrier.
Corintis’s solution has two core components. First, co-designed microfluidic cooling. This involves advanced simulation and optimization software. It also uses new manufacturing methods. These methods craft micro-scale liquid cooling systems. They are perfectly adapted to each chip. They direct coolant precisely where needed.
The technology offers flexibility. It can function as a drop-in replacement. It integrates into existing liquid cooling systems. Alternatively, it can be co-packaged directly with the chip. Co-packaging offers an order of magnitude increase in cooling performance. This adaptability supports diverse data center needs.
Beyond performance, Corintis addresses environmental concerns. Its technology reduces data center water consumption. This is a critical ecological benefit of AI technologies. The platform builds a bridge between chip and cooling design. It empowers chip designers. They can create next-generation AI chips. These chips will boast superior thermal performance.
Corintis developed specific technology platforms. Glacierware automates cooling system design. It streamlines complex processes. A copper microfluidic manufacturing facility ensures high-volume production. It manufactures cold plates with features as fine as a human hair. The Therminator platform offers physical emulation. Chip companies can test next-gen chips. They validate cooling solutions pre-production with millimeter accuracy.
Corintis already boasts a robust market presence. It manufactured over ten thousand cooling systems. These systems operate in data centers. They cool leading-edge AI chips. The company reported 8-digit cumulative revenue since incorporation. It forecasts a tenfold revenue increase from early deployments.
Future plans include significant scaling. The team of 55 employees will grow. It aims for over 70 by year-end. Manufacturing capacity will expand dramatically. Corintis targets production exceeding one million microfluidic cold plates annually by 2026. This massive scale prepares for widespread adoption.
Global expansion is underway. Corintis will open multiple US offices. These will serve its growing American customer base. An engineering office in Munich, Germany, is also planned. This strategic expansion solidifies its international footprint.
Corintis positions itself at the forefront of DeepTech cooling. Its specialized focus on co-designed microfluidic cooling distinguishes it. While some solutions reduce heat generation, Corintis directly manages waste heat. It provides a high-complexity solution to a pressing problem. This signals strong investor confidence in its niche.
Corintis is not merely improving cooling. It is redefining the limits of computational power. It addresses AI's biggest thermal challenge. By making cooling a fundamental design feature, not an afterthought, Corintis unlocks unprecedented performance. It paves the way for the next wave of AI innovation. The company empowers faster, more powerful, and more sustainable AI. Its impact will resonate across the entire technology landscape.
The age of artificial intelligence demands vast computational power. AI models grow larger, more complex. This trend requires increasingly potent computer chips. Yet, these powerful processors create an immense problem: heat. Excessive heat throttles performance. It risks chip failure. Cooling has emerged as a critical bottleneck for AI's future.
Early AI training utilized NVIDIA chips consuming 400 watts. Today, new GPUs and AI accelerators demand ten times that power. Liquid cooling becomes essential. NVIDIA's own shift to liquid cooling for data center GPUs underscores this urgency. Traditional cooling methods fall short. They rely on simplistic designs. These methods cannot cope with modern chip densities.
Corintis steps in with a radical solution. The company focuses on microfluidic cooling. This technology optimizes liquid cooling at a micro-scale. It targets computer chips within data centers. These centers power generative AI and advanced computation. Corintis's approach is unique. It co-designs cooling systems with the chip itself.
Each chip presents a distinct thermal landscape. Billions of transistors connect with countless wires. Corintis creates complex networks of precisely shaped micro-channels. These channels guide coolant to critical hot spots. This customized design overcomes generic cooling limitations. It promises a significant leap in thermal management.
Corintis’s recent $24 million Series A round highlights investor confidence. Total funding now stands at $33.4 million. BlueYard Capital led the round. Founderful, Acequia Capital, Celsius Industries, and XTX Ventures also participated. This capital infusion will fuel expansion. It will accelerate manufacturing capabilities.
The company has strengthened its leadership. Lip-Bu Tan joined the board. He chairs Walden International and serves as Intel CEO. Geoff Lyon also joined. Lyon founded and led CoolIT. These strategic additions bridge the semiconductor industry. They connect design, manufacturing, and advanced chip cooling expertise. This solidifies Corintis's industry position.
A significant breakthrough came from a Microsoft partnership. Corintis collaborated to develop an in-chip microfluidic cooling system. This system was tested successfully. It cooled a server running core services. Tests showed remarkable efficiency. Heat removal was three times better than leading conventional technologies. This achievement pushes boundaries.
This enhanced thermal margin has direct benefits. It translates to more software performance. It allows for greater overclocking potential. Crucially, it enables new 3D chip architectures. Stacking high-power system-on-chips (SoCs) was previously impossible. Thermal limitations prevented inner layer cooling. Corintis technology removes that barrier.
Corintis’s solution has two core components. First, co-designed microfluidic cooling. This involves advanced simulation and optimization software. It also uses new manufacturing methods. These methods craft micro-scale liquid cooling systems. They are perfectly adapted to each chip. They direct coolant precisely where needed.
The technology offers flexibility. It can function as a drop-in replacement. It integrates into existing liquid cooling systems. Alternatively, it can be co-packaged directly with the chip. Co-packaging offers an order of magnitude increase in cooling performance. This adaptability supports diverse data center needs.
Beyond performance, Corintis addresses environmental concerns. Its technology reduces data center water consumption. This is a critical ecological benefit of AI technologies. The platform builds a bridge between chip and cooling design. It empowers chip designers. They can create next-generation AI chips. These chips will boast superior thermal performance.
Corintis developed specific technology platforms. Glacierware automates cooling system design. It streamlines complex processes. A copper microfluidic manufacturing facility ensures high-volume production. It manufactures cold plates with features as fine as a human hair. The Therminator platform offers physical emulation. Chip companies can test next-gen chips. They validate cooling solutions pre-production with millimeter accuracy.
Corintis already boasts a robust market presence. It manufactured over ten thousand cooling systems. These systems operate in data centers. They cool leading-edge AI chips. The company reported 8-digit cumulative revenue since incorporation. It forecasts a tenfold revenue increase from early deployments.
Future plans include significant scaling. The team of 55 employees will grow. It aims for over 70 by year-end. Manufacturing capacity will expand dramatically. Corintis targets production exceeding one million microfluidic cold plates annually by 2026. This massive scale prepares for widespread adoption.
Global expansion is underway. Corintis will open multiple US offices. These will serve its growing American customer base. An engineering office in Munich, Germany, is also planned. This strategic expansion solidifies its international footprint.
Corintis positions itself at the forefront of DeepTech cooling. Its specialized focus on co-designed microfluidic cooling distinguishes it. While some solutions reduce heat generation, Corintis directly manages waste heat. It provides a high-complexity solution to a pressing problem. This signals strong investor confidence in its niche.
Corintis is not merely improving cooling. It is redefining the limits of computational power. It addresses AI's biggest thermal challenge. By making cooling a fundamental design feature, not an afterthought, Corintis unlocks unprecedented performance. It paves the way for the next wave of AI innovation. The company empowers faster, more powerful, and more sustainable AI. Its impact will resonate across the entire technology landscape.